DOIONLINE 
DOIONLINE Publish In |
International Journal of Industrial Electronics and Electrical Engineering (IJIEEE)-IJIEEE |
 Journal Home Volume Issue |
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Issue |
Volume-8,Issue-6 ( Jun, 2020 ) | |||||||||
Paper Title |
Stress Analysis of Mems Microneedles - A Simulation Study | |||||||||
Author Name |
Shilpa Nagod, S.V Halse | |||||||||
Affilition |
Research Scholar, Akkamahadevi Women’s University, Department of Electronics, Vijayapura, Karnataka, India Vice-Chancellor, Davangere University, Davangere, Karnataka, India | |||||||||
Pages |
8-10 | |||||||||
Abstract |
This paper presents the design and simulation of MEMS Microneedle for its’ stress analysis. Every material will be capable of withstanding only a certain amount of stress and beyond that they would break. Here a microneedle is designed using Comsol and simulated for different materials like Silicon, Titanium, Stainless Steel, Aluminium and it is analysed whether that microneedle of particular material can withstand the force of 1.29N which is the general force that is applied at the other end of microneedle for proper insertion. Keywords - MEMS, Microneedles, Stress Analysis | |||||||||
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